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Three-dimensional integrated circuit
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141	FUTURE VISIONS AND CURRENT CONCERNS SECTION 1 Add to Reading List Source URL: homepages.rpi.edu Language: English - Date: 2012-03-29 22:25:26 Microtechnology Three-dimensional integrated circuit Back end of line Wafer Very-large-scale integration Microelectromechanical systems Monocrystalline silicon Flip chip Etching Semiconductor device fabrication Electronics Technology
142	Microassembly Technologies for MEMS Michael B. Cohn¤‡, Karl F. Böhringer+º, J. Mark Noworolski¤‡, Angad Singh‡, Chris G. Keller§, Ken Y. Goldberg+, and Roger T. Howe¤‡ Add to Reading List Source URL: www.ee.washington.edu Language: English* - Date: 2003-07-05 01:01:00 Technology Microelectromechanical systems Surface micromachining Microfabrication Micro-Opto-Electro-Mechanical Systems Flip chip Integrated circuit Etching Three-dimensional integrated circuit Materials science Microtechnology Semiconductor device fabrication
143	PDF Document Add to Reading List Source URL: www.tezzaron.com Language: English - Date: 2008-02-08 14:35:02 Semiconductor device fabrication Electromagnetism Semiconductor devices Three-dimensional integrated circuit Through-silicon via Light-emitting diode Back end of line Integrated circuits Electronics Electronic engineering
144	PDF Document Add to Reading List Source URL: www.monolithic3d.com Language: English - Date: 2012-02-01 05:16:01 Technology Semiconductor device fabrication Semiconductor devices Three-dimensional integrated circuit Flash memory Very-large-scale integration Multigate device Transistor Logic gate Integrated circuits Electronics Electronic engineering
145	PDF Document Add to Reading List Source URL: www.objective-analysis.com Language: English - Date: 2012-08-03 02:52:23 Electronics Network On Chip Advanced Microcontroller Bus Architecture EnSilica Semiconductor device fabrication Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronic design automation
146	PDF Document Add to Reading List Source URL: www.gradient-da.com Language: English - Date: 2010-04-29 14:20:31 Heat conduction Heat transfer Semiconductor device fabrication Passive fire protection Electronics manufacturing Three-dimensional integrated circuit Heat sink Thermal conductivity Back end of line Chemistry Chemical engineering Electronic engineering
147	PDF Document Add to Reading List Source URL: www.gradient-da.com Language: English - Date: 2010-06-20 01:39:41 Electronics Electronic engineering Semiconductor device fabrication Heat transfer Three-dimensional integrated circuit Thermal conductivity Heat conduction Integrated circuits Chemistry
148	PDF Document Add to Reading List Source URL: www.gradient-da.com Language: English - Date: 2012-02-03 19:45:42 Semiconductor device fabrication Heat transfer Heat conduction Integrated circuits Passive fire protection Three-dimensional integrated circuit Heat sink Thermal conductivity Back end of line Chemical engineering Mechanical engineering Electronic engineering
149	PDF Document Add to Reading List Source URL: nepp.nasa.gov Language: English - Date: 2005-07-22 21:03:59 Semiconductor device fabrication Electronics manufacturing Integrated circuits Multi-chip module Chip scale package Ball grid array Printed circuit board Dual in-line package Three-dimensional integrated circuit Electronics Electronic engineering Electromagnetism